When requesting a MICRONANOFABS service you will be granted access to the facilities provided by each of the three nodes as a whole (access to combined technology or facilities of two or more access nodes) or to a single unit (access to the technology and/or facilities of a single node).

You can request access to the MICRONANOFABS network centrally through the online form.

IMB-CNM Services

IMB-CNM logo.

The IMB-CNM offer will be made through the ICTS clean-room in the following technology areas and associated services:


Thermal and Chemical Vapour Deposition(CVD)

  • Oxidation and annealing furnaces diffusion tubes
  • LPCVD and PECVD of silicon oxide and nitride, polysilicon and BPSG
  • ALD high-k dielectric
  • RTP processes for SiC

Ion Implantation

  • Different species implant: B, P, As, N, Ar, Al, Si, Mg, O, I


  • DC and DC / RF sputtering systems, thermal evaporation and e-beam of a variety of metals: Al-Cu (5%), Cu, Ti, W, Ni Au, Cr and Ag


  • Contact / proximity and double side aligners
  • g-line and i-line Steppers
  • Automatic photoresist coating / developing system
  • Maskless lithography laser (i-line)
  • Processing of standard and special photoresists (thick)

Nanolithography / Nanofabrication with sub-100 nm resolution

  • Electron beam lithography (EBL)
  • Nanoimprint Lithography (NIL)
  • Focused ion beam (FIB)
  • Atomic force Lithography (AFM)

Dry etching

  • RIE reactive ion etching for aluminum, polysilicon, silicon oxide and silicon nitride
  • Deep RIE (DRIE) for silicon and silicon dioxide etching
  • Plasma Ashers for photoresist removal

Wet etching

  • Isotropic chemical wet etching of a variety of materials
  • Cleaning processes for microelectronics fabrication

Microsystems Processes

  • Silicon volume micromachining. Wet anisotropic etching with alkaline solutions
  • Silicon surface micromachining
  • Critical point drying for releasing micromachined structures
  • Lift-off processes
  • Wafer Anodic Bonding: Si-Si, Si-pyrex



  • Wafer sawing and chip singulation
  • Chip packaging processes, including surface mount (SMT) and flip-chip
  • Wire-bonding

Electrical characterization

  • Device characterization and parameter extraction
  • In-wafer parametric test
  • Design-test structures
  • Development of new measurement techniques

Structural Characterization and Microscopy

  • Measurement of layer thickness and profiles
  • Optical contrast microscopy, polarization and co-focal
  • Electron microscopy (SEM)
  • SEM EDX Characterization
  • Atomic Force Microscopy (AFM)

Reverse Engineering and Reliability

  • Reconstruction of the logic blocks of an integrated circuit
  • Decapsulated and retrieval of electronic devices and integrated circuits
  • Technological characterization of electronic devices and integrated circuits
  • Editing by laser integrated circuits and/or FIB (focused ion beam)

Design of Integrated Circuits and Electronic Systems Integration

  • Characterization of circuits and devices
  • Printed circuit board design (PCB)
  • Design of circuits and systems: IC design
  • PCB component mounting

ISOM Services

ISOM logo.

The ISOM and its Technology Centre offer, through the ICTS, services in the following technology areas:


  • Deposition in Joule evaporators (Au, Au, boom, AuZn, Ni, etc)
  • Deposition in e-beam evaporators (Au, Pt, Ti, Al, etc.)
  • Chemical vapor deposition (CVD) of insulating (Si-ON systems)
  • Sputtering of magnetic materials (Fe, Ni, Co, FeNi, etc.)
  • Molecular beam epitaxy (MBE) semiconductors (AlGaInAs and AlGaInN families)
  • Electroplating Au layers, Ni, CoP, etc.
  • Hanging-contacts fabrication



  • Nanolithography "e-line" (line resolution> 10 nm)
  • Electronic lithography (EBL) (resolution> 300 nm)
  • Photolithography (resolution> 1 micron)
  • Design of optical masks

Chemical and Mechanical treatment

  • Cleaning (organic acids, bases...)
  • Wet Etching
  • Reactive Ion Etching (RIE)

Thermal Processes

  • Conventional annealing
  • Rapid thermal annealing (RTA)

Welding and packaging

  • Wire-bonding
  • Packaging and wire-bonding in TO-5, TO-8 and other packages
  • Polishing (manual machine)
  • Precision cutting



  • Sample preparation for measurements at low temperature and room temperature
  • Photoluminescence measurement (UV-VIS-IR) in the range 10-300K
  • Electroluminescence measurements
  • FTIRS measurement (600 nm-20 microns)


  • Device preparation
  • Spectral detectors responsivity measurement (from 12 microns to 200 nm)
  • Spectral emission laser measurement (from 600-1700 nm)
  • Spectral luminescent emission measurement (from 200 nm to 2.5 microns)
  • UV-VIS-IR measurement of lasers L-I curves

Electric and Magnetic

  • Resistivity measurements, room temperature
  • Measurement of transport properties due to Hall Effect and temperature dependence (15-300K)
  • IV and CV measurement, ambient temperature, temperature dependence and frequency
  • Measurement of hysteresis cycles in thin films

Structural and Microscopy

  • Thickness measurement and profilometry
  • Photography and polarization contrast microscope
  • Sample preparation for SEM study
  • SEM EDX characterization, with reference
  • SEM Surface characterization
  • AFM and MFM Characterization
  • X-Ray Diffraction

NTC Services

NTC logo.

The NTC, through its ICTS facilities in Micro/Nanofabrication and its associated laboratories, offer the following techniques:


Thermal processes

  • Thermal oxidation and annealing processes
  • Rapid thermal annealing (RTA)

Layer Deposition

  • Polysilicon and dielectric deposition by PECVD
  • B & P Doped silicon oxide TEOS-based
  • PVD (physical vapor deposition) evaporation systems and e-beam


  • Photoresist processing systems and revealed
  • UV Mask aligner and I-line stepperP
  • e-beam direct writing

Dry etching

  • Dry etching (ICP-RIE): polysilicon and silicon oxide etching
  • Photoresist Stripping

Wet etching

  • Wet etching and cleaning
  • Lift-Off Process

Ion Implantation

  • Ion implanter

Complete line for optical coupling and packaging

  • Die-attach
  • Wire-bonding, Ribbon Bonding
  • Flip-chip
  • Thermo-compression
  • Reflow (flux-free) with laser
  • Flux-less /solder paste/void free soldering
  • Wafer bump reflow
  • Fiber splicing


  • Physical characterization (SEM, AFM, profilometer)
  • Raman spectroscopy
  • NSOM microscopy
  • Optical Characterization (FTIR Measurement of refractive index)
  • Electrical characterization (IV EQE / IQE, Lifetime, sheet resistance and contact)
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